Products - Hardware innovation technology services.

Home > Products > Electronic Components > PCB Circuit Board > Double-sided high frequency board maximum 610×457mm

New Products

Double-sided high frequency board maximum 610×457mm

Double-sided high frequency board maximum 610×457mm is made of advanced production technology and high-quality materials, with excellent high-frequency performance and stability. It is suitable for various applications that require high-frequency signal transmission, such as communication equipment, radio equipment, radar systems, etc. The board has a double-sided design, which can provide more circuit layout space to meet the needs of complex circuits.

Send Inquiry

Product Description

Double-sided High Frequency Board Maximum 610×457mm combines high-quality materials and advanced manufacturing processes to ensure stability and reliability during high-frequency signal transmission. The board supports a variety of customization options and can be personalized according to the specific needs of users.

Copper thickness	1oz
Minimum hole diameter	0.15mm
Minimum line width	3mil
Minimum line spacing	3mil
Surface treatment	HASL lead-free/ ENIG/ OSP/ custom
Product name	PCB
Surface treatment	HASL lead-free/ ENIG/ OSP/ custom
Material	FR-4/ CEM-1/ CEM3/ custom
Testing service	Flying probe test/fixture electronic test/ custom
Finished copper thickness	1oz/ 1.5oz/ 2oz/ custom
Solder mask color	Green/blue/red/ custom
Silk screen color	White/black/ custom
Thickness	1.6mm/ custom

Customization service: Provide comprehensive customization services, including customization in size, material, circuit layout and frequency response. A professional team of engineers will work closely with users to ensure that customized boards meet users' specific needs.
High-quality materials: Use high-quality insulating materials and advanced copper plating processes to ensure the electrical performance and mechanical strength of the boards.
Material selection and preparation: Select the same substrate (such as FR-4, PTFE, etc.) and copper foil as the original board.
Manufacturing and processing: Use advanced circuit board manufacturing processes (such as laser drilling, electroplating, etching, etc.) to manufacture clone boards.