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Single-sided thermoelectric separation copper substrate

Greeting factory manufacturer Single-sided thermoelectric separation copper substrate has excellent thermal conductivity and electrical insulation performance. The single-sided thermoelectric separation copper substrate has undergone strict quality control and durability testing to ensure that it has extremely high reliability during use. The single-sided thermoelectric separation copper substrate has undergone strict quality control and durability testing to ensure that it has extremely high stability and durability during use.

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Product Description

Greeting Factory Manufacturer Single-sided Thermoelectric Separation Copper Substrate is an innovative electronic product that combines high-quality materials, advanced technology, fashionable design and customized services. Greeting Factory Manufacturer Single-sided Thermoelectric Separation Copper Substrate is designed for efficient heat dissipation and precise temperature control of modern electronic devices, aiming to meet the market demand for high-performance and high-reliability electronic materials.

Copper thickness	0.5-20 ounces (maximum 33 ounces)
Minimum aperture	0.08 millimeters
Minimum line spacing	2 mil
Surface Treatment	Bare copper, lead-free soldering, gold plating, etc
Flammable	UL 94V-0
Number of layers	1-40
HDI construction	Any layer, up to 4+N+4
Copper thickness	0.5-20 ounces (maximum 33 ounces)
Plate thickness	0.1~7 millimeters
V-CUT tolerance	± 10 miles
Quality testing	AOI, 100% electronic testing
Distortion and deformation	≤ 0.50% (maximum limit)

High-quality materials: The substrate is made of high-purity copper to ensure excellent thermal conductivity and good mechanical strength, providing stable and efficient heat dissipation support for electronic devices.

Advanced technology: The latest thermoelectric separation technology is introduced to achieve precise separation of heat and current, reduce energy consumption, and improve equipment performance. Advanced production processes are used to ensure the flatness and precision of the substrate surface and improve the assembly quality and stability of electronic components.

Fashion design: The product design keeps up with industry trends, using simple yet fashionable elements to add a touch of color to electronic devices.

Customization service: Provide comprehensive customization services, including substrate size, thickness, thermoelectric separation layer configuration, etc., to meet the diverse needs of users

Price advantage: Greeting manufacturers are committed to providing the most competitive prices to ensure that users can enjoy high-quality products while also getting the most cost-effective.