China Ul 94v-0 Single Sided Thermoelectric Copper Substrate Manufacturer, Supplier, Factory

In the competitive landscape of thermal management, selecting the right substrate directly impacts product longevity and safety. Our range builds upon the core Ul 94v-0 Thermoelectric Copper Substrate, which delivers cost-effective flame-retardant performance for general lighting and power modules. For harsher environments, the Ul 94v-0 Thermoelectric Copper Substrate for Auto adds reinforced resin systems to withstand under-hood thermal cycling and vibration. Electric vehicle power electronics demand minimal thermal resistance, a challenge met by the Thickness Thermoelectric Copper Substrate for EV, which fine-tunes copper thickness for high-current joints. When circuit density becomes paramount, the Multilayer Separation Copper Substrate enables layered architectures without sacrificing thermal transfer. All these variants share a single-sided design philosophy that simplifies assembly and reduces interfacial thermal resistance.


The Ul 94v-0 Single Sided Thermoelectric Copper Substrate represents a refined balance between manufacturability and heat dissipation. Built on a high-purity copper base, it integrates a thermally conductive, glass-reinforced dielectric layer that reliably meets UL 94V-0 vertical burn requirements. The single-circuit-layer architecture speeds up SMT assembly, lowers per-unit cost, and forms a robust foundation for Peltier-based thermoelectric modules, high-bay LED arrays, and compact power converters. Its consistent copper peel strength and low moisture absorption ensure stability even after multiple reflow cycles.

  • UL 94V-0 vertical burn classification for fire safety compliance
  • Single-sided circuitry ideal for automated pick-and-place and reflow soldering
  • Thermoelectric-grade dielectric with homogeneous ceramic filler distribution
  • Copper base conductivity of 385 W/m·K rapidly pulls heat away from hot spots
  • Available surface finishes: ENIG, immersion silver, OSP, lead-free HASL
  • RoHS 3 and REACH compliant across the full thickness range
  • Compatible with standard PCB tooling, routing, and V-scoring
  • Tailored panel sizes up to 600 mm × 600 mm minimize material waste
Parameter Specification
Base copper grade C1100 (99.9% Cu)
Dielectric material Ceramic-filled epoxy/glass woven composite
Thermal conductivity (Z-axis) ≥ 3.2 W/m·K
Thermal conductivity (X-Y plane) 1.2 W/m·K
Glass transition temperature (Tg) 170 °C (DSC)
Decomposition temperature (Td, 5% weight loss) 340 °C
Copper peel strength (1 oz) ≥ 1.4 N/mm
Flammability rating UL 94V-0
Max operating temperature 150 °C continuous
Solder float resistance 288 °C, 10 s pass (no delamination)
Standard thicknesses 1.0, 1.5, 2.0, 2.5, 3.0, 3.2 mm
Top copper foil options 18 µm (0.5 oz) to 140 µm (4 oz)
Surface finish choices ENIG (0.05 µm Au), immersion Ag, OSP, LF HASL
Solder mask colors White (standard), black, green, custom RAL
Max panel dimensions 600 mm × 600 mm
Minimum annular ring 0.15 mm
CTE (X-Y, below Tg) 12–14 ppm/°C

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