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SlovenskiIn the competitive landscape of thermal management, selecting the right substrate directly impacts product longevity and safety. Our range builds upon the core Ul 94v-0 Thermoelectric Copper Substrate, which delivers cost-effective flame-retardant performance for general lighting and power modules. For harsher environments, the Ul 94v-0 Thermoelectric Copper Substrate for Auto adds reinforced resin systems to withstand under-hood thermal cycling and vibration. Electric vehicle power electronics demand minimal thermal resistance, a challenge met by the Thickness Thermoelectric Copper Substrate for EV, which fine-tunes copper thickness for high-current joints. When circuit density becomes paramount, the Multilayer Separation Copper Substrate enables layered architectures without sacrificing thermal transfer. All these variants share a single-sided design philosophy that simplifies assembly and reduces interfacial thermal resistance.
The Ul 94v-0 Single Sided Thermoelectric Copper Substrate represents a refined balance between manufacturability and heat dissipation. Built on a high-purity copper base, it integrates a thermally conductive, glass-reinforced dielectric layer that reliably meets UL 94V-0 vertical burn requirements. The single-circuit-layer architecture speeds up SMT assembly, lowers per-unit cost, and forms a robust foundation for Peltier-based thermoelectric modules, high-bay LED arrays, and compact power converters. Its consistent copper peel strength and low moisture absorption ensure stability even after multiple reflow cycles.
| Parameter | Specification |
|---|---|
| Base copper grade | C1100 (99.9% Cu) |
| Dielectric material | Ceramic-filled epoxy/glass woven composite |
| Thermal conductivity (Z-axis) | ≥ 3.2 W/m·K |
| Thermal conductivity (X-Y plane) | 1.2 W/m·K |
| Glass transition temperature (Tg) | 170 °C (DSC) |
| Decomposition temperature (Td, 5% weight loss) | 340 °C |
| Copper peel strength (1 oz) | ≥ 1.4 N/mm |
| Flammability rating | UL 94V-0 |
| Max operating temperature | 150 °C continuous |
| Solder float resistance | 288 °C, 10 s pass (no delamination) |
| Standard thicknesses | 1.0, 1.5, 2.0, 2.5, 3.0, 3.2 mm |
| Top copper foil options | 18 µm (0.5 oz) to 140 µm (4 oz) |
| Surface finish choices | ENIG (0.05 µm Au), immersion Ag, OSP, LF HASL |
| Solder mask colors | White (standard), black, green, custom RAL |
| Max panel dimensions | 600 mm × 600 mm |
| Minimum annular ring | 0.15 mm |
| CTE (X-Y, below Tg) | 12–14 ppm/°C |